Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation


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Falk A., Marsavina L., Pop O.

FRATTURA ED INTEGRITA STRUTTURALE, vol.14, no.51, pp.541-551, 2020 (Peer-Reviewed Journal) identifier identifier

  • Publication Type: Article / Article
  • Volume: 14 Issue: 51
  • Publication Date: 2020
  • Doi Number: 10.3221/igf-esis.51.41
  • Journal Name: FRATTURA ED INTEGRITA STRUTTURALE
  • Journal Indexes: Emerging Sources Citation Index, Scopus, Academic Search Premier, Agricultural & Environmental Science Database, Compendex, Directory of Open Access Journals
  • Page Numbers: pp.541-551
  • Keywords: Digital image correlation, Finite element analysis, PCB, Strain, BGA SOLDER JOINTS, MODEL

Abstract

This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs).