Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

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Falk A., Marsavina L., Pop O.

FRATTURA ED INTEGRITA STRUTTURALE, vol.14, no.51, pp.541-551, 2020 (ESCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 14 Issue: 51
  • Publication Date: 2020
  • Doi Number: 10.3221/igf-esis.51.41
  • Journal Name: FRATTURA ED INTEGRITA STRUTTURALE
  • Journal Indexes: Emerging Sources Citation Index (ESCI), Scopus, Academic Search Premier, Agricultural & Environmental Science Database, Compendex, Directory of Open Access Journals
  • Page Numbers: pp.541-551
  • Keywords: Digital image correlation, Finite element analysis, PCB, Strain, BGA SOLDER JOINTS, MODEL
  • Ankara Haci Bayram Veli University Affiliated: No

Abstract

This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs).