Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Creative Commons License

Falk A., Marsavina L., Pop O.

FRATTURA ED INTEGRITA STRUTTURALE, cilt.14, sa.51, ss.541-551, 2020 (ESCI) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 14 Sayı: 51
  • Basım Tarihi: 2020
  • Doi Numarası: 10.3221/igf-esis.51.41
  • Dergi Adı: FRATTURA ED INTEGRITA STRUTTURALE
  • Derginin Tarandığı İndeksler: Emerging Sources Citation Index (ESCI), Scopus, Academic Search Premier, Agricultural & Environmental Science Database, Compendex, Directory of Open Access Journals
  • Sayfa Sayıları: ss.541-551
  • Anahtar Kelimeler: Digital image correlation, Finite element analysis, PCB, Strain, BGA SOLDER JOINTS, MODEL
  • Ankara Hacı Bayram Veli Üniversitesi Adresli: Hayır

Özet

This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs).